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 Preliminary data
BUZ 103SL-4
SIPMOS (R) Power Transistor
* Quad-channel * Enhancement mode * Logic level * Avalanche-rated * dv/dt rated
Type BUZ 103SL-4
VDS
55 V
ID
4.8 A
RDS(on)
0.055
Package P-DSO-28
Ordering Code C67078-S. . . .- . .
Maximum Ratings Parameter Continuous drain current one channel active Symbol Values 4.8 Unit A
ID IDpuls
19.2
TA = 25 C
Pulsed drain current one channel active
TA = 25 C
Avalanche energy, single pulse
EAS
140 dv/dt 6
mJ
ID = 4.8 A, VDD = 25 V, RGS = 25 L = 12 mH, Tj = 25 C
Reverse diode dv/dt kV/s
IS = 4.8 A, VDS = 40 V, diF/dt = 200 A/s Tjmax = 175 C
Gate source voltage Power dissipation ,one channel active
VGS Ptot
14 2.4
V W
TA = 25 C
Operating temperature Storage temperature IEC climatic category, DIN IEC 68-1
Tj Tstg
-55 ... + 175 -55 ... + 175 55 / 175 / 56
C
Semiconductor Group
1
05/Sep/1997
Preliminary data
BUZ 103SL-4
Thermal Characteristics Parameter Symbol min. Thermal resistance, junction - soldering point 1) Thermal resistance, junction - ambient 2) Values typ. tbd 62.5 max. K/W Unit
RthJS RthJA
-
1) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer,70m thick) copper area for Drain connection. PCB is vertical without blown air.
2) one channel active
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit
V(BR)DSS
55 1.6 0.1 10 0.0403 2
V
VGS = 0 V, ID = 0.25 mA, Tj = 25 C
Gate threshold voltage
VGS(th)
1.2
VGS=VDS, ID = 50 A
Zero gate voltage drain current
IDSS
0.1 1 100
A
VDS = 55 V, VGS = 0 V, Tj = -40 C VDS = 55 V, VGS = 0 V, Tj = 25 C VDS = 55 V, VGS = 0 V, Tj = 150 C
Gate-source leakage current
IGSS
100
nA 0.055
VGS = 20 V, VDS = 0 V
Drain-Source on-resistance
RDS(on)
VGS = 5 V, ID = 4.8 A
Semiconductor Group
2
05/Sep/1997
Preliminary data
BUZ 103SL-4
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit
gfs
tbd 770 230 130 -
S pF 960 290 165 ns 50 75
VDS 2 * ID * RDS(on)max, ID = 0 A
Input capacitance
Ciss Coss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Output capacitance
VGS = 0 V, VDS = 25 V, f = 1 MHz
Reverse transfer capacitance
Crss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Turn-on delay time
td(on)
VDD = 30 V, VGS = 5 V, ID = 4.8 A RG = 6.5
Rise time
tr
30 45
VDD = 30 V, VGS = 5 V, ID = 4.8 A RG = 6.5
Turn-off delay time
td(off)
20 30
VDD = 30 V, VGS = 5 V, ID = 4.8 A RG = 6.5
Fall time
tf
40 1.33 20 32.6 2.94 60 nC 2 30 50 V 3 05/Sep/1997
VDD = 30 V, VGS = 5 V, ID = 4.8 A RG = 6.5
Gate charge at threshold
Qg(th) Qg(5)
-
VDD = 40 V, ID 0.1 A, VGS =0 to 1 V
Gate charge at 5.0 V
VDD = 40 V, ID = 4.8 A, VGS =0 to 5 V
Gate charge total
Qg(total)
-
VDD = 40 V, ID = 4.8 A, VGS =0 to 10 V
Gate plateau voltage
V(plateau)
VDD = 40 V, ID = 28 A
Semiconductor Group
Preliminary data
BUZ 103SL-4
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS TA = 25 C Inverse diode direct current, pulsed A 0.9 55 93 4.8 19.2 V 1.6 ns 85 nC 140 Values typ. max. Unit
ISM VSD trr Qrr
TA = 25 C
Inverse diode forward voltage
VGS = 0 V, IF = 9.6 A
Reverse recovery time
VR = 30 V, IF=lS, diF/dt = 100 A/s
Reverse recovery charge
VR = 30 V, IF=lS, diF/dt = 100 A/s
Semiconductor Group
4
05/Sep/1997
Preliminary data
BUZ 103SL-4
Power dissipation Ptot = (TA)
Drain current ID = (TA) parameter: VGS 5 V
5.0 A
2.8 W 2.4
Ptot
2.2 2.0 1.8
ID
4.0 3.5 3.0
1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 140 C 180 0.5 0.0 0 20 40 60 80 100 120 140 C 180 1.5 1.0 2.5 2.0
TA
TA
Safe operating area ID = (VDS) parameter: D = 0, TC = 25C
10 2
=
on )
Transient thermal impedance Zth JA = (tp) parameter: D = tp / T
10 2 K/W
tp = 1.4ms
/I D
VD
S
A
R
( DS
10 1
ID
10 1
10 ms
ZthJC
10 0
10 -1
10 0
10 -2 D = 0.50 10 -3 0.20 0.10
10 -1 DC
10 -4
0.05 0.02
10 -5 single pulse
0.01
10 -2 0 10
10
1
V 10
2
10 -6 -8 -7 -6 -5 -4 -3 -2 -1 0 10 10 10 10 10 10 10 10 s 10
VDS
tp
Semiconductor Group
5
05/Sep/1997
Preliminary data
BUZ 103SL-4
Typ. output characteristics ID = (VDS) parameter: tp = 80 s
11 A
Typ. drain-source on-resistance RDS (on) = (ID) parameter: tp = 80 s, Tj = 25 C
0.17
Ptot = 2W j
li k hf e g d
VGS [V] a 2.0
b c 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 7.0 8.0 10.0
a
b
ID
9 8 7 6 5 4 3 2
c
0.14 RDS (on) 0.12
d e f g h i j k l
0.10
0.08
c d e f g hi j
0.06 0.04
VGS [V] =
a 2.5 2.0 3.0 b 3.5 c 4.0 d 4.5 e f 5.0 5.5 g 6.0 h i j 7.0 8.0 10.0
0.02 1
b
0 a 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
V
5.0
0.00 0
2
4
6
8
A
11
VDS
ID
Typ. transfer characteristics ID = f (VGS)
parameter: tp = 80 s VDS2 x ID x RDS(on)max
90 A
ID
70 60 50 40 30 20 10 0 0
1
2
3
4
5
6
7
8
V VGS
10
Semiconductor Group
6
05/Sep/1997
Preliminary data
BUZ 103SL-4
Drain-source on-resistance RDS (on) = (Tj) parameter: ID = 4.8 A, VGS = 5 V
0.15
Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = 50 A
4.6 V 4.0
0.13
RDS (on)0.12
0.11 0.10 0.09 0.08 0.07 0.06 0.05 0.04 0.03 0.02 0.01 0.00 -60
VGS(th)
3.6 3.2 2.8
98%
2.4
98%
2.0
typ
1.6
typ 2%
1.2 0.8 0.4
-20
20
60
100
C
180
0.0 -60
-20
20
60
100
C
180
Tj
Tj
Typ. capacitances
C = f (VDS) parameter:VGS = 0V, f = 1MHz
10 4
Forward characteristics of reverse diode IF = (VSD) parameter: Tj, tp = 80 s
10 3
A
C
pF
IF
10 2
10 3
Ciss
10 1
Tj = 25 C typ Tj = 175 C typ Coss Crss
5 10 15 20 25 30 V 40 VDS
Tj = 25 C (98%) Tj = 175 C (98%)
10 2 0
10 0 0.0
0.4
0.8
1.2
1.6
2.0
2.4
V
3.0
VSD
Semiconductor Group
7
05/Sep/1997
Preliminary data
BUZ 103SL-4
Avalanche energy EAS = (Tj) parameter: ID = 4.8 A, VDD = 25 V RGS = 25 , L = 12 mH
150 mJ 130
Typ. gate charge VGS = (QGate) parameter: ID puls = 5 A
16
V
EAS 120
110 100 90 80 70 60 50 40 30 20 10 0 20
VGS
12
10
8 0,2 VDS max 0,8 VDS max
6
4
2 0 0
40
60
80
100
120
140
C
180
5
10
15
20
25
30
35
40
nC
50
Tj
QGate
Drain-source breakdown voltage V(BR)DSS = (Tj)
65
V
V(BR)DSS
61
59
57
55
53
51 49 -60
-20
20
60
100
C
180
Tj
Semiconductor Group
8
05/Sep/1997


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